Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

The CoWoS-L, expected to begin mass production in the second half of this year, is projected to be applied to NVIDIA's next-generation products, such as the GB300. Some have raised concerns that ...

View the Nvidia roadmap for 2025–2027, including the new GPUs like Blackwell Ultra B300, RTX 5090, Rubin, and Rubin Ultra. Explore new chips’ capabilities.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Sony has confirmed the cancellation of two in-development live-service games, one of which was based in the tumultuous God of ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly ...