Multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. The proposed PUF features excellent resistance against ...
Kudelski Group / Key word(s): Miscellaneous Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation 03.12.2024 / 17:45 CET/CEST Kudelski's ...
To join the CNBC Technology Executive Council, go to cnbccouncils.com/tec Companies including PepsiCo, Intel and Qualcomm are working on breakthroughs in the Ambient ...
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