Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

The CoWoS-L, expected to begin mass production in the second half of this year, is projected to be applied to NVIDIA's next-generation products, such as the GB300. Some have raised concerns that ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

View the Nvidia roadmap for 2025–2027, including the new GPUs like Blackwell Ultra B300, RTX 5090, Rubin, and Rubin Ultra. Explore new chips’ capabilities.