HIgh-speed data centers and AI advances continue to drive leading-edge development in data and power signaling techniques and ...

The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die systems more efficiently in AI data ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

ZHUHAI, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- As global demand for intelligent, energy-efficient ...

New cable assembly delivers full-speed 128 GT/s PAM4 PCIe Gen7 connectivity over 7 meters without retimer latency or ...

Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.

Measured performance is equally serious. The N-05XE offers a frequency response of 5 Hz to 30 kHz (-3 dB), a signal-to-noise ...

“Until we as a nation are able to establish and maintain a system that will break intergenerational poverty, we cannot expect ...

David George, Senior Member of Technical Staff at AMD, continues to play a key role in advancing high-performance and adaptive computing platforms, drawing on more than 17 years of experience in ...

XIAMEN CITY, FUJIAN PROVINCE, CHINA, January 20, 2026 /EINPresswire.com/ -- The underwater connector industry continues ...

Completion of a two-year R&D programme moves the technology from theoretical design to technical readiness for commercial deployment in remote regions.

Acquisition expands Leidos' access to growing, resilient utility budgets Adds complementary capabilities and customers, bringing Leidos into the utility gas and electric generation infrastructure ...