JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Abstract: We report the advantages of using CMOS directly bonded to array (CBA) technology in 3D flash memory. Improvements in interface speed, operation latency, and memory cell reliability are ...
Asynchronous Task and Memory Interface, or ATMI, is a runtime framework for efficient task management in heterogeneous CPU-GPU systems. It provides a consistent API to create and launch tasks from ...
Our episodic memory – the ability to recall past events and experiences – is known to decline as we age. Exactly how and why has remained something of a mystery, and a recent study goes some way ...
Abstract: HfO 2-based ferroelectric FETs (FeFETs) have emerged as promising candidates for embedded non-volatile memory (NVM). However, achieving a wide memory window (MW) without compromising ...
Memory chips are a key component of artificial intelligence data centers. The boom in AI data center construction has caused a shortage of semiconductors, which are also crucial for electronics like ...
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