FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...
FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant.
On the morning of January 28th, FPT announced the establishment of a semiconductor chip testing and packaging factory in ...
The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...
As part of a global effort to save the environment, Intel Corp. and National Semiconductor have unveiled plans to become lead-free by the year’s end As part of a global effort to save the environment, ...
SASTRA Deemed University hosts Indo-Taiwan conference on semiconductor packaging and testing, enhancing industry-academia collaboration for India's semiconductor growth.
On January 28, Vietnam’s FPT Group announced the establishment of the country’s first locally-owned and operated ...
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...
The establishment of the advanced semiconductor chip testing and packaging factory demonstrates FPT’s commitment to ...
FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...
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