Kenji Hata (Prime Senior Researcher), the Nanotube Research Center (NTRC; Director: Sumio Iijima) of the National Institute of Advanced Industrial Science and Technology (AIST; President: Ryoji ...
Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...
Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...
DELFT, Netherlands — A practical and economical means for boosting the performance of inductors on mixed-signal RF/CMOS chips might come from a project here at the Delft Institute of Microelectronics' ...
Lithium metal shows great promise as an anode material for next-generation high-energy-density batteries. However, the issues of dendrite growth and huge volume fluctuations that occur with lithium ...
High-power electronics demand much more from printed circuit boards than standard gadgets do. When your design needs to ...
A reduction of silver consumption in PV production is required on the way to terawatt scale. Given this, the time may have come for the commercialization of new copper plating technologies – doing ...
Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: ...
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