Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...
EL DORADO HILLS, Calif.--(BUSINESS WIRE)--Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, and eYs3D Microelectronics, the image processor solution provider ...
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